High-Performance Flexible Printed Circuits with VECSTAR™ High performance circuits with flexible shape design
Are you facing these challenges?
- Difficulty in reducing the thickness of circuits for millimeter-wave communication
- Inability to maintain complex 3D shapes, limiting design flexibility in compact spaces
- High manufacturing costs for advanced high-frequency circuits
- Challenges in achieving environmentally friendly circuit solutions
Solution: Unlock Advanced Circuit Design with VECSTAR™
VECSTAR™ enables the production of high-performance flexible circuits that are lightweight, compact, and capable of maintaining complex three-dimensional shapes.
This liquid crystal polymer (LCP) film offers:
- Exceptional electrical performance
- Low moisture absorption
- Three dimensional stability
- Flame resistance
- High heat resistance
By adopting VECSTAR™, manufacturers can support millimeter-wave technologies while achieving significant reductions in device size and weight.
Thinner and Smaller Circuits
VECSTAR™ allows circuit thickness to be reduced by up to 30% compared to conventional modified polyimide materials.
This contributes to:
- Miniaturization of devices
- Weight reduction
- Enhanced design flexibility in compact applications
Integration into Tight Spaces with 3D Formability
After circuit fabrication, VECSTAR™ enables thermoforming into three-dimensional shapes while retaining the intended structure.
This capability allows:
- Efficient integration into confined spaces
- Innovative circuit designs
- Further device miniaturization and weight reduction
Key Features
Proven and Emerging Applications
Smartphones
Smartwatches
Laptops and tablets
Automotive electronics
Smart keys
